Xiaomi has revealed the design of its next foldable smartphone
Xiaomi has unveiled the design and key specifications for its upcoming Xiaomi 18 Fold smartphone. The device will feature a 3-nanometer XRING O3 chip, LPDDR6 memory, and a 200 MP Leica camera system.
Why it matters
This launch highlights the rapid advancement of Chinese hardware manufacturing and the competitive race to integrate next-generation mobile components into foldable form factors.
Xiaomi has revealed the design of its next foldable smartphone in the passport form factor – the Xiaomi 18 Fold. The novelty was shown in red.It is known that the device will have a 5.38-inch external display and a 7.58-inch screen when unfolded.As previously reported, the Xiaomi 18 Fold will be one of the first smartphones from the Chinese company to receive its new 3-nanometer chip XRING O3.
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