Too thin to fail: an alternative to copper microchip interconnects
Cornell researchers have identified niobium arsenide nanowires as a potential replacement for copper in microchip interconnects. Unlike copper, which becomes more resistive as it shrinks, this topological semimetal improves its conductivity at the nanoscale.
Why it matters
As microchips continue to shrink, current copper-based technology faces physical limitations; this discovery could enable the next generation of high-performance computing.
A scanning electron microscope image shows nanowires of niobium arsenide still attached to a bulk feedstock.
The article is a straightforward report on scientific research and material engineering advancements.
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