SK Hynix Unpacks Advanced Packaging Technologies, Including Intel EMIB, For Its Next-Gen HBM Memory As It Eyes 3D Structures For The Future
SK Hynix is advancing its high-bandwidth memory (HBM) roadmap by integrating sophisticated packaging technologies like Intel's EMIB. The company is transitioning toward 3D-stacked structures to improve performance, capacity, and power efficiency for next-generation AI and GPU applications.
Why it matters
As AI demand surges, the efficiency of memory packaging becomes a critical bottleneck for computing performance, making these technical advancements vital for the semiconductor industry.
SK Hynix is leveraging advanced packaging technologies such as Intel's EMIB for its next-gen HBM solutions, which will eventually enter the 3D packaging stage.
At Hot Chips 2026, Jaesik Lee (VP Package Engineering at SK Hynix) presented the "Advanced Packaging for High-Bandwidth Memory" brief, which talks about how the company plans to leverage advanced packaging tech to accelerate its HBM roadmap.
The company started by presenting how HBM is currently built. The HBM structure consists of a 3D stacked structure that connects multiple core dies (DRAM ICs) to a base die using TSVs. HBM can currently reach a maximum height of 16 slices, or a 16-Hi stack.
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