SK hynix HBM Packaging at Hot Chips 2026
SK hynix presented technical details on their HBM4 high-bandwidth memory technology at the Hot Chips 2026 conference. The presentation covered 3D stacking, bonding techniques, and performance improvements over previous generations.
Why it matters
Advancements in HBM are critical for the future of AI hardware and high-performance computing infrastructure.
SK hynix’s Hot Chips 2026 presentation is around high-bandwidth memory (HBM) and advanced packaging. From a slide flip, it looks like they will be covering the 3D stacking, bonding, and system integration choices behind high-bandwidth memory.
Like the others, we are doing these live, so please excuse typos.
SK hynix began by explaining that HBM is a 3D-stacked structure comprising a base die and a stack of core dies, up to 16 slices in total. GPU and HBM sit together on a silicon interposer in a 2.5D package and communicate via 1024 IOs across 16 channels, with four slices per rank and four ranks in a 16-high stack. Getting that interposer connection right matters because it is where HBM meets the accelerator.
Higher bandwidth, higher capacity, and higher power efficiency are the why behind advancing HBM.
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