[News] Intel EMIB-T Push Gains Momentum as TSMC CoWoS Crunch Drives Spillover; Unimicron, ASE Stand to Benefit

TSMC’s advanced packaging capacity remains tight, with CoWoS orders fully booked. According to Economic Daily News , sources say some back-end advanced packaging orders are spilling over to Intel’s Malaysia operations to support shared major customers, breaking with traditional industry practices. The arrangement could help accelerate TSMC’s front-end advanced process shipments, while institutional investors expect shared supply-chain partners, including ASE and substrate suppliers, to benefit.

As the report indicates, back-end advanced packaging capacity has struggled to keep pace with front-end wafer output, prompting expectations that TSMC will welcome additional suppliers providing capacity support. TSMC Chairman C.C. Wei has previously welcomed competitors adding packaging capacity to ease shortages and give customers greater flexibility, noting that such support could ultimately benefit TSMC’s front-end wafer manufacturing business.