Midea To Unveil Industry-First Power-Cooling Hyperconvergence Architecture at Data Center World Asia 2026
Midea Building Technologies is set to unveil a new hyperconverged architecture for data centers at Data Centre World Asia 2026 in Singapore. The technology aims to integrate power and cooling systems to improve efficiency for high-density AI workloads.
Why it matters
As AI computing demands increase, innovations in data center cooling and power management are critical for reducing energy consumption and operational costs.
SINGAPORE , Sept. 28, 2026 /PRNewswire/ -- Midea Building Technologies (MBT) will participate in Data Centre World Asia 2026 on September 29–30 at Marina Bay Sands, Singapore. At Booth T10, MBT will present three highlights: the industry's first power-cooling hyperconverged architecture, a full-stack AI data centre (AIDC) cooling solution with three flagship products, and strategic collaboration with Keppel. An Omdia white paper commissioned by Midea will be released on the afternoon of September 29.
As AI workloads push rack densities far beyond CPU-era designs, data centres face two critical challenges: bringing sufficient power into the facility, and removing heat efficiently once it is there. Conventional designs treat the two as separate engineering disciplines — an approach that becomes harder to sustain as rack power climbs.
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