Huawei building 12-inch chip wafer plant to deal with DRAM shortage
Huawei is reportedly partnering with the Chinese government to build a 12-inch wafer plant in Shenzhen to mitigate DRAM memory chip shortages. The facility aims to produce 140,000 wafers per month using a 28nm process to bolster China's self-reliance in the semiconductor industry.
Why it matters
This move represents a strategic effort by China to bypass US export controls and reduce dependence on foreign memory chip suppliers.
Huawei is reportedly teaming up with the Chinese government to build a new 12-inch chip wafer plant that can help it cut off some pressure from DRAM shortages. A new report suggests that the company is once again up to framing its own solution.
X tipster @ SemiconductorX has revealed that Huawei has joined hands with Swaysure (Shenzhen Yiweixu) to develop a 12-inch chip wafer plant in Shenzhen, China .
The Chinese government is backing this fab. Details reveal that the new move will significantly focus on DRAM memory chipsets with a capacity of 140,000 wafers/month.
DRAM memory chips under this fab will begin with 28nm. The companies have also hired an experienced workforce that can rapidly reach a beneficial outcome.
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