Highly filled liquid epoxy for smaller, more reliable chip packaging
Researchers at National Taiwan University have developed a new liquid epoxy for chip packaging that balances high silica loading with processability. By optimizing particle size and adding rubber nanoparticles, the team created a material that is both durable and resistant to cracking.
Why it matters
Advances in chip packaging materials are essential for the continued miniaturization and reliability of high-performance computing hardware.
edited by Sadie Harley , reviewed by Andrew Zinin
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Add as preferred source Visual abstract. Credit: Materials Horizons (2026). DOI: 10.1039/d6mh00645k As computer chips become more powerful and compact, the materials that protect them must perform better than ever. In advanced chip packaging, liquid epoxy is widely used because it can flow into tiny spaces before curing into a solid protective layer. To be effective, the material must be easy to process in its liquid state while becoming strong, stable and reliable after curing.
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