Fungal mycelium instead of epoxy resin: compostable printed circuit board developed

Researchers at TU Bergakademie Freiberg have developed a compostable printed circuit board (PCB) made from fungal mycelium. This innovation aims to address the growing global problem of electronic waste by providing a biodegradable alternative to traditional fossil-based epoxy resins.
Why it matters
As electronic waste reaches record levels, sustainable material science breakthroughs are critical for reducing the environmental impact of consumer technology.
Worldwide, discarded electronic toys, computers, or smartphones are becoming increasingly massive amounts of electronic waste. The basis for electronic circuits are printed circuit boards (PCB), which are typically made of glass fiber-reinforced fossil epoxy resin, making them difficult to recycle, let alone biodegrade. A team from TU Bergakademie Freiberg has now presented a fully compostable alternative made from the mycelium of the Aspergillus niger fungus, a byproduct of industrial citric acid production.
Instead of disposing of this biomass waste, the team processes it into a plastic-like material through an innovative process involving molding and air-drying, resulting in a small, approximately 0.5 cm thick plate with a density of 1.23 g/cm³, comparable to the density of conventional printed circuit boards (PCBs). Using direct ink writing or a standard etching process and manual soldering, the researchers were able to deposit electronic components directly onto the fungal plates.
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